Mechanism for generation of voids bounded on Cu conductors in Cu/glass ceramic co-fired multilayer wiring substrates

Author:

OKAMOTO Masahide1,MINAGAWA Madoka1,ISHIHARA Shosaku1,AMI Norihiro1,SHINOZAKI Kazuo2

Affiliation:

1. Production Engineering Research Laboratory, Hitachi Ltd.

2. Department of Metallurgy and Ceramics Science, Tokyo Institute of Technology

Publisher

Ceramic Society of Japan

Subject

Materials Chemistry,Condensed Matter Physics,General Chemistry,Ceramics and Composites

Reference19 articles.

1. Multilayer Ceramic Circuit Board with a Copper Conductor

2. 2) K. Niwa, N. Kamehara, H. Yokoyama, K. Yokouchi and Y. Imanaka, Advances in Ceramics, 19, 41-47 (1987).

3. 3) K. Niwa, Y. Imanaka, N. Kamehara and S. Aoki, Advances in Ceramics, 26, 323-337 (1989).

4. 4) Y. Shimada, K. Utsumi, M. Suzuki and H. Takamizawa, Electronic Components Conference, 33, 314-319 (1983).

5. 5) S. H. Kinckerbocker, A. H. Kumar and L. W. Herron, Am. Ceram. Soc. Bull., 72[1], 90-95 (1993).

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