Filler Debonding & Subhybrid-layer Failures in Self-etch Adhesives

Abstract

The mechanisms behind bond degradation are still largely unknown, in particular with respect to self-etch adhesives. One-step adhesives have been especially documented with problems, such as insufficient polymerization, water-uptake and subsequent plasticization, water- and enzyme-induced nanoleakage, and/or the presence of voids due to phase-separation or osmosis. It was hypothesized that these shortcomings may weaken the adhesive layer and, as such, may jeopardize long-term bonding. In contrast to the control three-step etch & rinse adhesive, the bond strength to dentin of both one-step and two-step self-etch adhesives decreased after six-month water storage. TEM revealed not only that they exhibited filler de-bonding within the adhesive resin layer, due to hydrolysis of the filler-matrix coupling, but also that they failed predominantly directly under the hybrid layer at dentin, in spite of the presence of interfacial droplets and nanoleakage in the adhesive layer. These failures just under the hybrid layer may be attributed to insufficient encapsulation of surface smear.