A novel reliability index approach and applied it to cushioning packaging design

Author:

An Xue1ORCID,Huang Bowen2,Shi Dongyan1

Affiliation:

1. Department of Mechanical and Electrical Engineering, Harbin Engineering University, Harbin, Heilongjiang, PR China

2. Department of Mechanical and Aerospace Engineering Rutgers, The State University of New Jersey, Piscataway, NJ, USA

Abstract

This paper is aimed at proposing a new approach to Reliability-based Design Optimization (RBDO) and applying it to cushioning packaging design with a highly nonlinear system. The problem is formulated as an RBDO problem, which is included a minimizing cost function and probabilistic constraints. Here, the thickness of the cushion material is dealt with uncertainty and uncontrolled parameters. The traditional reliability index approach (RIA) has evolved as a powerful tool to solve the RBDO problem; however, due to its convergence problem, the modified reliability index approach (MRIA) is proposed. Although the MRIA method solves the problems of the traditional RIA, it inherits the low efficiency of searching for the most probability point (MPP). Thus, we developed a novel RIA based on MRIA to improve the efficiency and robustness during the RBDO process. The innovation active set strategy is developed in reliability assessment, which is a strict inequality to determine whether the current constraint is active or inactive. An application example is presented, and the results are compared with MRIA to assess cost-effectiveness and efficiency. Results indicate the proposed method is feasible to solve the uncertainty problem of packaging materials in the processing process and is also an efficient RBDO method.

Publisher

SAGE Publications

Subject

Mechanical Engineering

Reference49 articles.

1. Predicting the Effect of Temperature on the Shock Absorption Properties of Polyethylene Foam

2. Relevant materials parameters in cushioning for EPS foams

3. ASTM D:1998. 1596, Standard test methods for dynamic shock cushioning characteristics of packaging material. Philadelphia, PA: American Society of Testing and Materials.

4. Theory and practice of cushion curve: A supplementary discussion

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