A novel single component epoxy resin adhesive with microcapsule latent curing agent of 2-phenylimidazole/polymethyl acrylic glycidyl ester-Reference-Cited by-同舟云学术

A novel single component epoxy resin adhesive with microcapsule latent curing agent of 2-phenylimidazole/polymethyl acrylic glycidyl ester

Published:2013-12-18 Issue:5 Volume:47 Page:439-448
ISSN:0095-2443
Container-title:Journal of Elastomers & Plastics
language:en
Short-container-title:Journal of Elastomers & Plastics

Author:

Ma Aijie¹²,Zhang Qiuyu¹,Zhang Hepeng¹,Shi Youqiang¹,Liu Yu¹

Affiliation:

1. Key Laboratory of Applied Physics and Chemistry, Ministry of Education, School of Science, Northwestern Polytechnical University, Xi’an, People’s Republic of China

2. School of Materials and Chemical Engineering, Xi’an Technological University, Xi’an, People’s Republic of China

Abstract

2-Phenylimidazole (2-PZ) and polymethyl acrylic glycidyl ester (PGMA) are performed to fabricate a novel microcapsule latent curing agent of 2-PZ/PGMA by solvent evaporation method with 2-PZ as the core material and PGMA as the shell material. A novel single-component 2-PZ/PGMA/epoxy adhesive is also prepared by mixing 2-PZ/PGMA with epoxy resin matrix. The 2-PZ/PGMA microcapsules are characterized using scanning electron microscopy and granulometer. The curing kinetics and thermal properties of 2-PZ/PGMA/epoxy resin system are also investigated using differential scanning calorimeter, Fourier transform infrared spectrometer, and thermogravimetric analysis. Results show that 2-PZ/PGMA has good sphericity and narrow diameter distribution. The curing process of the 2-PZ/PGMA/epoxy resin system contains autocatalytic mechanism. Compared with that of pure epoxy, the presence of the 2-PZ/PGMA has little effect on thermal stability for the epoxy.

Publisher

SAGE Publications

Subject

Materials Chemistry,Polymers and Plastics

Link

http://journals.sagepub.com/doi/pdf/10.1177/0095244313516888

Reference16 articles.

1. The use of dihydrazides as latent curing agents in diglycidyl ether of bisphenol A coatings

2. Latent Curing Agent Modified Epoxy Sizing Agent for High Modulus Carbon Fiber

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