Experimental Studies for Particle Damping on a Bond Arm

Abstract

Particle damping has been found to be a promising passive vibration suppression technique in aerospace applications. This paper investigates the feasibility of using particle damping technology on packaging equipment in semiconductor industries, such as a lightly damped bond arm in a die bonding machine. It is implemented by way of attaching an enclosure filled with granular materials to appropriate locations on the bond arm for suppressing residual vibration during positioning. In addition, several system parameters are studied experimentally, including granule size, packing ratio, enclosure material, structural form of enclosure, and enclosure location. It has been shown that the vibration of the bond arm is dramatically suppressed by a small quantity of particles.