Thermal Diffusivities of Composites with Various Types of Filler

Author:

Hatta Hiroshi1,Taya Minoru2,Kulacki F.A.3,Harder J.F.3

Affiliation:

1. Materials and Electronic Devices Laboratory Mitsubishi Electric Corporation 1-1-57 Miyashimo, Sagamihara Kanagawa 229, Japan

2. Department of Mechanical Engineering University of Washington Seattle, WA 98195

3. College of Engineering Colorado State University Fort Collins, CO 80523

Abstract

In-plane and out-of-plane thermal diffusivities (conductivities) of Kerimid resin composites reinforced with various types of filler were studied both experimentally and theoretically. The types of filler used are SiO2 particle, Al2O3 short fiber, Boron Nitride (BN) flake, and Si3N4 whisker. The prediction based on our previous model (Eshelby's equivalent inclusion method) agreed reasonably well with the experiment, except for BN flake composite. It was found that the orientation of filler has a strong effect on the overall thermal conductivity of a composite.

Publisher

SAGE Publications

Subject

Materials Chemistry,Mechanical Engineering,Mechanics of Materials,Ceramics and Composites

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