Creep evaluation and temperature dependence in self-sensing micro carbon polymer-based composites for further development as an Internet of Things Sensor device

Author:

Tomás Miguel1ORCID,Jalali Said2,Silva de Vargas Alexandre2

Affiliation:

1. Civil Engineering Department, University of Minho, Guimarães, Portugal

2. Civil Engineering Department, Federal University of Santa Maria, Brazil

Abstract

This article investigates the dependency of temperature on electrical resistance (R) change in micro carbon fiber polymer composites (MCFPC), for further development as an Internet of Things sensor from previous research works. Three mixtures were prepared using Dow Corning’s Silastic 145 as base polymer and made vary fiber content weight percentages: fiber diameter to length ratio ∅⁄l 0.13 and carbon fiber content of 13%; ∅⁄l:0.66 and carbon fiber contents of 40% and 50%. Composites tested were submitted to temperature loading, with a constant strain of 0.0%, for assessment of R when a change in the composite’s temperature occurs. The composite response was observed to follow an Arrhenius function, for temperatures ranging from −10°C to 40°C. The apparent activation energy was calculated to evaluate further differences between carbon fiber contents and the sensitivity factor, [Formula: see text] due to temperature is determined. The specimens were also tested with a constant strain of 2.86% to assess creep. It was found that creep and R, over the period of time in the analysis, best fit a discrete latent variable model. The sensitivity factor change is determined in regard to stress relaxation, [Formula: see text]. The properties of MCFPC investigated here can be used to establish relationships between electrical resistance outputs and environmental loading conditions for this type of composites, enabling the possibility of deployment as part of a management system network for structural monitoring with real-time data acquisition.

Publisher

SAGE Publications

Subject

Materials Chemistry,Mechanical Engineering,Mechanics of Materials,Ceramics and Composites

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