Electrical and thermal conductivities of the Cu–CF composite
Author:
Affiliation:
1. Slovak Academy of Sciences, Institute of Materials and Machine Mechanics, Slovakia
2. Kompozitum, Ltd., R&D Department, Slovakia
Abstract
Funder
Vedecká Grantová Agentúra MŠVVaŠ SR a SAV
Agentúra na Podporu Výskumu a Vývoja
Publisher
SAGE Publications
Subject
Materials Chemistry,Mechanical Engineering,Mechanics of Materials,Ceramics and Composites
Link
http://journals.sagepub.com/doi/pdf/10.1177/0021998319872261
Reference18 articles.
1. Thermal expansion behaviour of unidirectional carbon-fibre-reinforced copper-matrix composites
2. Materials for thermal conduction
3. Assessing predictive schemes for thermal conductivity against diamond-reinforced silver matrix composites at intermediate phase contrast
4. Predicting the thermal conductivity of composite materials with imperfect interfaces
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