Tunable temperature-resistivity behaviors of carbon black/polyamide 6 /high-density polyethylene composites with conductive electrospun PA6 fibrous network

Author:

Qu Yingying1,Xu Ping2,Liu Hu1ORCID,Li Qianming1,Wang Ning1,Zhao Shuaiguo1,Zheng Guoqiang1,Dai Kun13,Liu Chuntai1,Shen Changyu1

Affiliation:

1. Key Laboratory of Materials Processing and Mold (Zhengzhou University), Ministry of Education, National Engineering Research Center for Advanced Polymer Processing Technology, Zhengzhou University, China

2. Shanghai Automobile Incoporation Company, Technology Center, China

3. State Key Laboratory of Polymer Materials Engineering, Sichuan University, PR China

Abstract

Temperature-resistivity behaviors of carbon black/polyamide 6/high-density polyethylene conductive polymer composites containing electrospun polyamide 6 fibrous network were studied systematically. The positive temperature coefficient intensity of the conductive polymer composites increased firstly and then reduced gradually with increasing heating rate, showing a heating rate-dependent positive temperature coefficient intensity. The fascinating phenomenon was ascribed to the microstructure change of conductive network induced by the volume expansion and the thermal residual stress generated in the composites. During the heating-cooling runs at different top testing temperature of 140, 150 and 180℃, the room-temperature resistivity of sample was observed to be 30, 2.3 and 1.6 orders of magnitude higher than the initial value after one heating-cooling run, respectively. The thermal treatment time above the melting temperature of high-density polyethylene and the viscosity variation of the conductive polymer composites were responsible for the increased resistivity. This study provides a guideline for fabricating conductive polymer composites with tuning positive temperature coefficient property.

Funder

Opening Project of State Key Laboratory of Polymer Materials Engineering

National Natural Science Foundation of China-Henan Talents Fostering joint Funds

he National Key Research and Development Program of China

National Natural Science Foundation of China

Publisher

SAGE Publications

Subject

Materials Chemistry,Mechanical Engineering,Mechanics of Materials,Ceramics and Composites

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