High-performance bismaleimide resins with low cure temperature for resin transfer molding process

Abstract

High-performance bismaleimide resin systems (here coined LBMI resin series) based on 4,4-bismaleimidodiphenylmethane, 2,4-bismaleimidotoluene, bisphenol A bisallyl ether, 4,4′-bis[2-(1-propenyl)phenoxy]benzophenone, 2-allylphenol, and cumene hydroperoxide for resin transfer molding (RTM) process with low cure and post-cure temperatures (≦180°C) have been developed. Considering the optimum formulation conditions, the injection temperature is in the range of 70–160°C, and the pot life at 100°C is determined to be approximately 100 min. After curing at 180°C for 6 h, the resins exhibit high thermal resistances, excellent mechanical properties, and exceptionally low dielectric loss. Among others, these findings render the materials suitable for the use as high-performance resins for the production of advanced composites via RTM technique and with low cure temperatures.