Curing behaviors of cyanate ester/epoxy copolymers and their dielectric properties

Author:

Lei Yangxue1,Xu Mingzhen1,Jiang Mingli1,Huang Yumin1,Liu Xiaobo1

Affiliation:

1. Research Branch of Functional Materials, Institute of Microelectronic and Solid State Electronic, High-Temperature Resistant Polymers and Composites Key Laboratory of Sichuan Province, University of Electronic Science and Technology of China, Chengdu, People’s Republic of China

Abstract

The curing behavior and dielectric properties of cyanate ester/epoxy (EP) with a latent initiator imidazole was investigated as a function of blend composition. Differential scanning calorimetry (DSC) was used to investigate the dynamic cure behavior of the blends. Multiheating rate DSC, peak fitting, and iso-conversion method were applied to analyze the curing kinetic parameters. Two distinct peaks were fitted from the dynamic DSC curve and the activation energies of each reaction varied with the increase of curing degrees. Fourier transform infrared spectra revealed that several reactions coexisted during the curing processes of cyanate and EP, resulting in the coexistence of the polymers and copolymers in the final composites. The dielectric properties of the composites were studied and the phenomenon that the dielectric constants for all of the composites are independent of frequency was observed. The thermal decomposition characteristics of the blends were investigated using thermogravimetric analysis. By increasing the content of EP, the thermal properties of the cured blends were improved to a small extent, while the char yield markedly decreased.

Publisher

SAGE Publications

Subject

Materials Chemistry,Organic Chemistry,Polymers and Plastics

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