Synthesis and Characterization of a Silicone Resin with Silphenylene Units in Si–O

Synthesis and Characterization of a Silicone Resin with Silphenylene Units in Si–O–Si Backbones II

Published:2010-08-04 Issue:8 Volume:22 Page:959-973
ISSN:0954-0083
Container-title:High Performance Polymers
language:en
Short-container-title:High Performance Polymers

Author:

Wu Chao-Bo¹,Jin Yu-Hong¹,Li Wei¹,Gao Da-Hai¹,Jia Meng-Qiu²

Affiliation:

1. State Key Laboratory of Chemical Resource Engineering, and Key Lab. of Beijing City on Preparation and Processing of Novel Polymer Materials, Beijing University of Chemical Technology, Beijing 100029, China

2. State Key Laboratory of Chemical Resource Engineering, and Key Lab. of Beijing City on Preparation and Processing of Novel Polymer Materials, Beijing University of Chemical Technology, Beijing 100029, China,

Abstract

A silicone resin with silphenylene units in Si—O—Si backbones was prepared through hydrolysis-polycondensation of self-synthesized 1,4-bis(diethoxymethylsilyl)benzene (BDSB) and other alkoxysilanes. The structure and properties of this novel silicone resin were characterized by gel permeation chromatography (GPC), Fourier transform infrared spectroscopy (FT-IR), nuclear magnetic resonance (NMR), thermogravimetric analysis (TG), scanning electron microscope (SEM) and electrochemical impedance spectrum (EIS). The results of GPC, IR and NMR showed that silphenylene units had been successfully incorporated into the backbones of silicone resin. TG analyses reveal that silicone resin with silphenylene units in its backbones had a higher heat resistance than the usual methyl phenyl silicone resin. SEM results demonstrated that this silicone resin could form a full and uniform film, and its clear paints were able to stand temperatures below 350 °C. EIS analysis revealed that clear paints of this silicone resin have good resistance to corrosion.

Publisher

SAGE Publications

Subject

Materials Chemistry,Organic Chemistry,Polymers and Plastics

Link

http://journals.sagepub.com/doi/pdf/10.1177/0954008309347660

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