Thermally stabilized bismaleimide–triazine resin composites for 10-GHz level high-frequency application

Abstract

A hybrid cured resin with excellent dielectric and thermal properties was prepared with bismaleimide–triazine (BT) resin modified with 2,2′-diallylbisphenol A (DBA). The thermal and dielectric properties of the resin were investigated, and the effect of DBA concentration on the curing reaction was determined. Results indicated that DBA significantly influenced the curing reaction and the properties of the cured product. The modified BT resins exhibited outstanding thermal stability (initial decomposition temperature was over 400°C), although the stability was slightly lower than that of pure BT resins. The dielectric constant and dielectric loss of the cured resin decreased when DBA was introduced into the BT resins. Moreover, the fabricated resins showed dielectric constant of 2.91–3.07 and dielectric loss lower than 0.0057 under the testing high-frequency range of 1 GHz to 15 GHz. Overall, the BT resins modified by DBA display great potential to be applied in high frequency field.