Development of a Cure/Postcure Cycle for PETI-330 Laminates Fabricated by Resin Transfer Molding

Author:

Bain Stewart1,Ozawa Hideki2,Criss Jim M.3

Affiliation:

1. S.A. Bain Consulting International Inc., Ottawa, Ontario, Canada;

2. UBE Industries Ltd., Tokyo, Japan

3. M & P Technologies, Inc. Marietta, GA 30068, USA

Abstract

As part of our product development effort for PETI-330, an investigation to determine the effect of a thermal cure cycle and thermal postcure treatment on laminate properties was conducted. Laminates of PETI-330/T650-35 carbon fabric (un-sized) were fabricated by resin transfer molding (RTM) using a high temperature injector. The resin was degassed at 525-550 °F (274-288 °C) and subsequently injected into an Invar tool and cured for 1 h at 700 °F(371 °C). The laminates were characterized for quality by ultrasonic inspection and acid digestion, the dry glass transition temperatures (Tg values) were determined by dynamic mechanical thermal analysis (DMTA). Specimens (7.6 cm × 7.6 cm) were subsequently machined from the panels and free-standing postcures were performed at 600 °F(316 °C), 625 °F (329 °C), 675 °F (357 °C) and 700 °F(371 °C) for 6 and 12 h at each temperature in flowing air at 1 atmosphere. The postcured specimens were characterized for weight loss, and dry and wet Tg values. The postcured laminates were machined into specimens approximately 7.6 cm × 6.4 cm and isothermal aging was performed for 100 h at 625 °F (329 °C), 650 °F(343 °C) and 700 °F(371 °C). After isothermal aging, the aged specimens were characterized for weight loss, dry and wet Tg and micro-cracking using optical microscopy. The results of this study are presented. Based on these results, the postcure conditions that gave the best combination of results were identified.

Publisher

SAGE Publications

Subject

Materials Chemistry,Organic Chemistry,Polymers and Plastics

Reference9 articles.

1. Transfer molding imide resins based on 2,3,3′,4′-biphenyltetracarboxylic dianhydride

2. High Temperature Transfer Molding Resins: Laminate Properties of PETI-298 and PETI-330

3. Yamaguchi H 1997 in Recent Advances in Polyimides R. Yokota and M. Hasegawa eds ( Tokyo, Japan: Raytech Co. ) p 5-5

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