Development of a Cure/Postcure Cycle for PETI-330 Laminates Fabricated by Resin Transfer Molding
Author:
Affiliation:
1. S.A. Bain Consulting International Inc., Ottawa, Ontario, Canada;
2. UBE Industries Ltd., Tokyo, Japan
3. M & P Technologies, Inc. Marietta, GA 30068, USA
Abstract
Publisher
SAGE Publications
Subject
Materials Chemistry,Organic Chemistry,Polymers and Plastics
Link
http://journals.sagepub.com/doi/pdf/10.1177/0954008306069393
Reference9 articles.
1. Transfer molding imide resins based on 2,3,3′,4′-biphenyltetracarboxylic dianhydride
2. High Temperature Transfer Molding Resins: Laminate Properties of PETI-298 and PETI-330
3. Yamaguchi H 1997 in Recent Advances in Polyimides R. Yokota and M. Hasegawa eds ( Tokyo, Japan: Raytech Co. ) p 5-5
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1. Effects of Curing Cycle and Thermal History on the Glass Transition Temperature of Adhesives;The Journal of Adhesion;2014-01-23
2. Resin Systems and Chemistry: Degradation Mechanisms and Durability;Long-Term Durability of Polymeric Matrix Composites;2011-08-22
3. Phenylethynyl-endcapped oligomides with low melt viscosities and high Tgs: effects of the molecular weights;High Performance Polymers;2011-07-06
4. Low Melt Viscosity Imide Resins for Resin Transfer Molding;Innovations in Materials Manufacturing, Fabrication, and Environmental Safety;2010-11-24
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