Durable crosslinked films based on poly (arylene ether nitrile) materials for ultrahigh temperature applications over 300°C

Abstract

Searching for outstanding films with high temperature resistance has sparked fierce interests in the electronics industry. In this study, a novel high-temperature-resistance phthalonitrile end-capped polyarylene ether nitrile (HTR-PEN-Ph) film was fabricated via cross-linking reaction, applying two different curing programs as contrast. The fabricated HTR-PEN-Ph films were verified through FTIR, gel content test to be confirmed the cross-linking reaction. Then thermal results elucidated that PEN-Ph films treated with two-stage curing program possessed a superior glass transition temperature ( T g) in comparison with untreated one, increasing by 165–270°C. Besides, an evident increment of 5 wt.% decomposition temperature ( T 5%) was seen from the HTR-PEN-Ph film, which was 27–43°C higher than the untreated one. Furthermore, the HTR-PEN-Ph films exhibited notable dielectric stability over 300°C and mechanical properties after the two-stage curing program. Based on these satisfactory results, this study is of great potential to be applied in the field of industrial manufacture to fabricate a range of high-performance films.