Effect of edge radius on forces, tool wear and surface integrity under edge radius dominated tool-chip contact conditions

Author:

S Joyson Selvakumar1ORCID,P Sakthivel1,Praveen Jerome Arul1,D Samuel Raj1ORCID

Affiliation:

1. Department of Mechanical Engineering, CEG, Anna University, Chennai, India

Abstract

Cutting-edge micro-geometry is a crucial factor influencing chip formation and tool performance. This paper investigates the effects of varying cutting edge radius (36–70 µm) on machinability and chip morphology during finish turning Ti6Al4V. An increase in edge radius decreases the cutting to thrust force ratio and produces lower chip thickness due to the increase in plowing zone depth. The machining temperature for the 48 and 52 µm edge radius tools is lower compared to all other tools. At the initial stage, the edge prepared tools exhibit larger flank wear, whereas subsequent flank wears progression is slower for the prepared tools as compared to the sharp tool. BUE and premature chipping is reduced for larger edge radius tool due to better edge stability provided by cutting edge preparation. Beyond the 59 µm edge radius, the process force, machining temperature, tool wear, and surface roughness increased steeply due to the increase in the size of the plowing zone. In addition to cutting force and machining temperature data, surface roughness, tool wear measurements and XRD analysis show that a radius range of 50–55 µm results in optimum performance for finish turning Ti6Al4V.

Publisher

SAGE Publications

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering

Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3