On investigations of thermal conductivity, circumferential compressive strength, and surface characterization of 3D-printed hybrid blended magnetostrictive PLA composite

Author:

Kumar Sudhir1ORCID,Singh Rupinder23ORCID,Singh TP1,Batish Ajay1

Affiliation:

1. Department of Mechanical Engineering, Thapar Institute of Engineering and Technology, Patiala, Punjab, India

2. Department of Production Engineering, Guru Nanak Dev Engineering College, Ludhiana, Punjab, India

3. Department of Mechanical Engineering, National Institute of Technical Teachers Training and Research, Chandigarh, Punjab, India

Abstract

In past two decades, the 3D printing of thermoplastic-based composite matrix has been widely explored for different engineering applications. But hitherto little has been reported on the preparation of polylactic acid (PLA) composite-based 3D-printed circular disc to ascertain its circumferential compressive strength, thermal conductivity, and morphological properties for possible structural engineering applications. The present investigation outlines the circumferential compressive strength, thermal conductivity, and morphological properties (Shore D hardness, surface voids using fractured surface analysis) of 3D-printed PLA composite matrix. Based upon the thermal conductivity test, it has been ascertained that sample printed on fused deposition modeling (FDM) setup with infill density of 100%, infill angle of 90°, and infill speed of 70 mm/s has shown maximum thermal conductivity (0.278 W/mK). Further it has been observed that with the increase in infill density, thermal conductivity of the sample has improved. Circumferential compressive testing has been performed on universal tensile testing machine setup (with in-house developed fixtures), and from printer setting optimization viewpoint, it has been ascertained that infill density has maximum contribution for peak and break strength. Further morphological studies (surface hardness, fractured surface analysis, and surface roughness (Ra) data) have supported the observed behavior of circumferential compressive strength and thermal conductivity of 3D-printed samples.

Publisher

SAGE Publications

Subject

Condensed Matter Physics,Ceramics and Composites

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