Layerwise Laminate Analysis of Functionally Graded Piezoelectric Bimorph Beams
Author:
Affiliation:
1. NASA Glenn Research Center, Structural Mechanics and Dynamics Branch, 21000 Brookpark Road, Mail Stop 49-8, Cleveland, Ohio 44135-3191, USA,
Abstract
Publisher
SAGE Publications
Subject
Mechanical Engineering,General Materials Science
Link
http://journals.sagepub.com/doi/pdf/10.1177/1045389X05050100
Reference11 articles.
1. Analysis of out-of-plane displacement and stress field in a piezocomposite plate with functionally graded microstructure
2. Solid-State Ceramic Actuator Designs
3. Laminated piezopolymer plates for torsion and bending sensors and actuators
4. Coupled layerwise analysis of thermopiezoelectric composite beams
Cited by 58 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Thermo-electro-elastic coupled modeling and simulation of functionally graded piezoelectric structures;Xibei Gongye Daxue Xuebao/Journal of Northwestern Polytechnical University;2023-10
2. Using modified Halpin Tsai based approach for electromechanical analysis of functionally graded graphene reinforced piezoelectric tile;International Journal of Mechanics and Materials in Design;2022-12-19
3. Modeling and Simulation of FGPM Cantilever Beam Under Quadratic Thermal Gradient Distribution;2022 16th Symposium on Piezoelectricity, Acoustic Waves, and Device Applications (SPAWDA);2022-10-11
4. Thermal buckling of a sandwich beam attached with piezoelectric layers via the shear deformation theory;Archive of Applied Mechanics;2022-02-21
5. Analytical solutions for laminated beams subjected to non-uniform temperature boundary conditions;Composite Structures;2022-02
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3