Adhesive Layer Effects in Surface-Mounted Piezoelectric Actuators

Abstract

The role of the adhesive layers in active panels with surface-mounted (bonded) piezoelectric layers is studied. The investigation focuses on the strain transfer mechanism between the active layers and the host structure, the stress concentrations involved, and the influence of the geometrical and mechanical properties of the adhesive layers on the static response of the panel. The analysis is based on the High-Order approach and uses 2D elasticity to model the adhesive layers. The mathematical formulation is derived using variational principles, compatibility requirements, and the piezoelectric constitutive equations. Confirmation of the analytical model is achieved through an experimental study that reveals good agreement between the theoretical predictions and the behavior of the active structure. Numerical results are presented for a typical piezoelectric active panel and compared to detailed 2D finite element analysis. The results reveal the high-order effects and the stress concentrations in the transition zone near the edge of the panel and indicate that a careful selection of the adhesive's properties can improve the behavior of the structure and reduce the severity of the stress concentrations involved. The paper concludes with a summary and recommendations for the analysis, design, and use of smart structures with bonded actuators.