Tunable Electric Field Processing of Composite Materials

Author:

Bowen Christopher P.,Shrout Thomas R.,Newnham Robert E.,Randall Clive A.1

Affiliation:

1. Intercollege Materials Research Laboratory, The Pennsylvania State University, University Park, PA 16802

Abstract

Using the dielectrophoretic effect, it is possible to fabricate polymer/ceramic composite materials in which the filler phase can be manipulated to form a desired microstructure. This is performed via the application of an electric field to a colloidal suspension consisting of a filler material dispersed in a fluid polymer medium. Field induced dipole-dipole interactions cause particles to experience a mutual interaction resulting in distinct particle chains which align parallel to the applied electric field direction. This chained microstructure can then be "frozen in" by crosslinking the polymer matrix. The chaining phenomena is dependent on both the magnitude and the frequency of the applied field. Optimum assembly conditions for this process are determined via optical microscopy and electrorheological measurements. The dielectrophoretic assembly process also has the advantage of in-situ quality control through dielectric measurements. Both the degree of alignment and the batch uniformity can be confirmed via dielectric measurements. By varying the applied field and frequency, chain coarseness can be manipulated giving rise to the ability to "tune" the properties of the composite. The dielectrophoretic assembly process is projected to be utilized for electrical, structural and thermal composite applications.

Publisher

SAGE Publications

Subject

Mechanical Engineering,General Materials Science

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3