Interface Fracture Assessment on Sandwich DCB Specimens

Abstract

This article examines the fracture behavior of sandwich type double cantilever beam (DCB) specimens under monotonic and cyclic loading conditions. The specimen consists of two layers of OFHC copper and one layer of ViaLux 81 photo-definable dry film. The ViaLux 81 is placed in between copper layers. Analytical expression for the strain energy release rate (GI) of the sandwich DCB specimen is derived by following the plate theory based model and compliance method. Finite element analysis has also been carried out on the specimen and the load displacement results for the specified crack or delamination length are obtained. The compliance equation in terms of the delamination length is derived for the specimens for obtaining the strain energy release rate (GI). From the generated R-curve of the interface, the failure load is estimated for the specified delamination length. From the crack growth data, the number of cycles to failure under cyclic loading is estimated for the initial delamination length.