An experimental study on the role of different void removal mechanisms in VBO processing of advanced thermoplastic composites

Author:

Swamy Jagadeesh N12ORCID,Grouve Wouter JB2ORCID,Wijskamp Sebastiaan1,Akkerman Remko12

Affiliation:

1. Production Technology, University of Twente, Enschede, Netherlands

2. Research, ThermoPlastic Composites Research Center (TPRC), Enschede, Netherlands

Abstract

The current study is focused on understanding the role of different void removal mechanisms in VBO processing of advanced thermoplastic composites. For this purpose, two commercially available Carbon/Poly-Ether-Ketone-Ketone (C/PEKK) tape materials were evaluated, distinct in morphologies, such as surface roughness and fiber-matrix distribution, and physical characteristics, mainly the presence of volatiles. The VBO consolidation results proved that the void reduction and removal mechanisms varied depending on the tape material. However, restricting the void reduction mechanism to dissolution and diffusion alone. Depending on the tape material, a significant difference in the consolidation dwell time was observed to achieve <1% void content parts. Thus, indicating that despite the tapes having the same polymer matrix, they differ in their diffusion behavior. The difference in the times required for consolidation may be due to the following. Firstly, the diffusion coefficients may be different for the two tapes. Although the matrix material in both tapes is PEKK, the exact formulation is unknown. Secondly, the volume of gases, which comprises entrapped air and the volatiles that evaporate during the process, that need to be removed maybe be different.

Publisher

SAGE Publications

Subject

Materials Chemistry,Polymers and Plastics,Mechanical Engineering,Mechanics of Materials,Ceramics and Composites

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