Computational study of hydrothermal characteristics in straight microchannels with base triangular and wavy profile designs for electronic cooling

Abstract

In the current study, computational analysis of the hydrothermal behavior of fluid flow in straight microchannels (MCs) with base triangular and wavy profile designs was conducted and the results were compared with that of straight MCs. The computational study was conducted in the 100–300 Reynolds number (Re) range. According to computational analysis, the thickness of the boundary layer grows as the fluid moves through straight MC, resulting in lower heat dissipation. Continual thinning and thickening of the boundary layer is seen to form in straight MC with triangular base and wavy profile designs. The fluid passing through the MC material can transfer heat more effectively as a result. Additionally, in straight MC with base wavy profiles designs, it was observed that there were more Dean vortices, reduction in stagnation zones, and lowering of channel base temperature. From the current study, it was noticed that straight MC with base wavy profiles designs showed higher heat transfer (0.5% to 21.14%), lower pressure drop (18.65% to 14.25%) compared to straight MC at Re range from 100 to 300, and higher overall performance factor compared to other designs.