Measurement of carbonization region on leather cutting in CO2 and diode laser-based laser beam process
Author:
Affiliation:
1. Department of Mechatronics Engineering, SRM Institute of Science and Technology, SRM Nagar, Kattankulathur, Kanchipuram, Chennai, TN, India
Abstract
Publisher
SAGE Publications
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering
Link
http://journals.sagepub.com/doi/pdf/10.1177/09544089211056317
Reference15 articles.
1. Laser Cutting of Leather: Tool for Industry or Designers?
2. Diode lasers: From laboratory to industry
3. A Study on Machinability of Leather Using CO2-Based Laser Beam Machining Process
4. Laser beam machining—A review
5. Laser cutting of various materials: Kerf width size analysis and life cycle assessment of cutting process
Cited by 10 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Review of semiconductor laser diode technologies for sustainable energy in leather machining;Clean Technologies and Environmental Policy;2024-08-02
2. Prediction and optimization kerf width in laser beam machining of titanium alloy using genetic algorithm tuned adaptive neuro-fuzzy inference system;The International Journal of Advanced Manufacturing Technology;2024-05-07
3. Implementation of LQR based SOD control in diode laser beam machining on leather specimens;Optics & Laser Technology;2024-03
4. Implementation and performance analysis of combined SOD and PWM control in diode based laser beam machining process on leather specimen;Optics & Laser Technology;2024-02
5. Performance Evaluation and MOORA Based Optimization of Pulse Width Control on Leather Specimens in Diode Laser Beam Cutting Process;Processes;2023-10-01
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3