Interference analysis and simulation of abrasive belt grinding and polishing of blisk

Author:

Zhang Lei1,Ding Chen1,Fan Cheng1ORCID,Yuan Qiang2,Wang Qian1,Wang Kejun1

Affiliation:

1. Jiangsu Provincial Key Laboratory of Advanced Robotics, College of Mechanical and Electrical Engineering, Soochow University, Suzhou, Jiangsu, China

2. School of Mechanical Science and Engineering, Jilin University, Changchun, Jilin, China

Abstract

Blisk is a difficult processing part with complex structure. The polishing quality and accuracy of the blade surface will significantly affect its performance and life. A new abrasive belt system is developed to grind and polish the blade on the blisk. In view of the problem that the abrasive belt is easy to interfere with the adjacent blades in the grinding and polishing process, an algorithm for judging the critical interference state is proposed based on the structural characteristics of the abrasive belt tool system and the actual grinding and polishing process of the blades. On the basis of above, a new algorithm is developed to calculate the range of interference-free wrap angle of the abrasive belt tool system. This paper established a simulation model based on VERICUT software and simulated the process of the blisk polishing. The simulation and experiment results verifies the effectiveness of the algorithm.

Funder

Natural Science Foundation of the Jiangsu Higher Education Institutions of China

postdoctoral science foundation of jiangsu province

National Natural Science Foundation of China

Publisher

SAGE Publications

Subject

Mechanical Engineering

Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3