Numerical stress analysis in adhesively bonded joints under thermo-mechanical loading

Author:

Al-Ramahi Nawres J12ORCID,Joffe Roberts1,Varna Janis1

Affiliation:

1. Division of Materials Science, Luleå University of Technology, Luleå, Sweden

2. Institute of Technology, Middle Technical University, Baghdad, Iraq

Abstract

The objective of this work is to evaluate the effect of residual thermal stresses, arising after assembling a single-lap joint at elevated temperature, on the inelastic thermo-mechanical stress state in the adhesive layer. The numerical analysis (FEM) employing linear and non-linear material models, with geometrical nonlinearity accounted for, is carried out. Simulating the mechanical response, the calculated thermal stresses are assigned as initial conditions to polymeric, composite and metallic joint members to reflect the loading sequence where the mechanical strain is applied to cooled-down structure. It is shown that the sequence of application matters and simulations with simultaneous application of temperature and strain give different result. Two scenarios for adhesive joints with composites are studied: joining by adhesive curing of already cured composite parts (two-step process) and curing the adhesive and the composite simultaneously in one-step (co-curing). Results show that while in-plane stresses in the adhesive are higher, the peaks of out-of-plane shear stress and peel stress (most responsible for the joint failure) at the end of the overlap are reduced due to thermal effects. In joints containing composite parts, the one-step joining scenario is more favorable than the two-step. The ply stacking sequence in the composite has significant effect on stress concentrations as well as on the plateau value of the shear stress in the adhesive.

Funder

orta doğu teknik üniversitesi

vinnova

Publisher

SAGE Publications

Subject

Mechanical Engineering

Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3