Using improved simulated anneal arithmetic to improve semiconductor packaging ball placement process capability
Author:
Affiliation:
1. Department of Commerce Automation and Management, National Pingtung University, Pingtung, Taiwan, R.O.C.
2. Department of Industrial Management, National Formosa University, Huwei, Taiwan, R.O.C.
Publisher
SAGE Publications
Subject
Mechanical Engineering
Link
http://journals.sagepub.com/doi/pdf/10.1177/1687814017746514
Reference32 articles.
1. Reliability of wafer level chip scale package (WLCSP) with 96.5Sn-3.5Ag lead-free solder joints on build-up microvia printed circuit board
2. Impact life prediction modeling of TFBGA packages under board level drop test
3. Effect of adhesive fillet geometry on bond strength between microelectronic components and composite circuit boards
4. Multi-objective system reliability-based optimization method for design of a fully parametric concept car body
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