Microstructure and mechanical properties of Cu/Sn-In/Cu joints obtained by ultrasonic-assisted transient liquid phase bonding in air

Author:

Bi Yan12,Nie Yong2,Wang Qian2ORCID,Han Jian2,Cai Yangchuan2

Affiliation:

1. School of Mechanical Engineering, Tianjin Sino-Germen University of Applied Sciences, Tianjin, China

2. School of Materials Science and Engineering, Tianjin University of Technology, Tianjin, China

Abstract

Ultrasonic-assisted transient liquid phase bonding of pure Cu with Sn-In solder was realized at 140°C in air. Shear test was carried out on the weldment. The effect of ultrasonic vibration on microstructure and mechanical properties of the weld seam was studied. The relationship between the formation of intermetallic compounds and their mechanical properties was analyzed by means of electronic scanning and element analysis. (Sn) solid solution, ε(Cu3Sn), η(Cu6Sn5), Cu10Sn3, Cu11In9, Cu9In4, γ, β phase were detected in the weld seam. When the ultrasonic vibration time is 30 s, the shear strength reached a maximum of 22.76 MPa. The fracture occurred on the surface of the fine-grained η(Cu6Sn5) phase. The fracture surface was partially covered with coarse-grained Cu11In9 phase, which belonged to a brittle fracture.

Funder

national natural science foundation of china

Publisher

SAGE Publications

Subject

Mechanical Engineering

Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Properties of Cu/Zn+15%SAC0307+15%Cu/Al joints by different ultrasonic-assisted degrees;Microelectronics International;2023-03-07

2. Review of ultrasonic-assisted soldering in Sn-based solder alloys;Journal of Materials Science: Materials in Electronics;2023-03

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