Experimental investigations into mechanical and thermal properties of rapid manufactured copper parts

Author:

Singh Gurminder1ORCID,Pandey Pulak M1ORCID

Affiliation:

1. Department of Mechanical Engineering, Indian Institute of Technology Delhi, New Delhi, India

Abstract

In the present paper, mechanical and thermal properties of rapidly manufactured copper parts were studied. The combination of three-dimensional printing and ultrasonic assisted pressureless sintering was used to fabricate copper parts. First, the ultimate tensile strength and thermal conductivity were compared between ultrasonic assisted and conventional pressureless sintered samples. The homogenously mixing of particles and local heat generation by ultrasonic vibrations promoted the sintering driving process and resulted in better mechanical and thermal properties. Furthermore, response surface methodology was adopted for the comprehensive study of the ultrasonic sintering parameters (sintering temperature, heating rate, and soaking time with ultrasonic vibrations) on ultimate tensile strength and thermal conductivity of the fabricated sample. Analysis of variance was performed to identify the significant factors and interactions. The image processing method was used to identify the surface porosity at different parameter levels to analyse the experimental results. High ultimate tensile strength was obtained at high sintering temperature, long soaking time, and slow heating rate with low surface porosity. After 60 min of soaking time, no significant effect was observed on the thermal conductivity of the fabricated sample. The significant interactions revealed less effect of soaking time at low sintering temperatures for ultimate tensile strength and less effect of heating rate at low sintering temperatures for thermal conductivity. Multi-objective optimization was carried out to identify parameters for maximum ultimate tensile strength and maximum thermal conductivity.

Publisher

SAGE Publications

Subject

Mechanical Engineering

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3