Bending deflection and stress analyses in a thin functionally graded material skew plate with different boundary conditions on the Winkler–Pasternak elastic foundation and under combined in-plane and uniform lateral loads using the extended Kantorovich method

Author:

Mamandi Ahmad1

Affiliation:

1. Department of Mechanical Engineering, Parand Branch, Islamic Azad University, Parand, Iran

Abstract

In this study, bending deflection and stress analyses have been conducted for a thin skew plate made of functionally graded material (FGM) with different boundary conditions on the Winkler–Pasternak elastic foundation and under combined loads including uniform transverse load, normal and shear in-plane forces, and planar body forces. The Cartesian partial differential equation governing the bending deflection of the skew plate has been converted into a partial differential equation in oblique coordinates using the conversion relations. Then, by employing the variational principle and residual weighted Galerkin method and using the Extended Kantorovich Method (EKM), the equation has been converted to a set of linear differential equations in terms of two functions in the longitudinal and transverse directions of the oblique plate, and afterward, the equation has been solved using the iterative solution method. Different boundary conditions in a combined form of simply and clamped supports have been investigated and their effects on bending deflection and generated in-plane normal and shear stresses are discussed.

Publisher

SAGE Publications

Subject

Mechanical Engineering

Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Design Optimization of Flexural and Eigenvalue Characteristics of Perforated and Skewed Bio-Composite Functionally Graded Panels;International Journal of Computational Methods;2024-05-30

2. Bending of a clamped thin isotropic plate by the Kantorovich method using special polynomials;Vestnik of Saint Petersburg University. Applied Mathematics. Computer Science. Control Processes;2023

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