Laser-assisted grinding of reaction-bonded SiC
Author:
Affiliation:
1. Centre for Precision Manufacturing, DMEM, University of Strathclyde, Glasgow, UK
2. School of Mechatronics, Harbin Institute of Technology, Harbin, PR China
3. School of Engineering and Physical Science, Heriot-Watt University, Edinburgh, UK
Abstract
Publisher
SAGE Publications
Link
http://journals.sagepub.com/doi/pdf/10.1177/2516598420965342
Reference15 articles.
1. Experimental study on brittle–ductile transition in elliptical ultrasonic assisted grinding (EUAG) of monocrystal sapphire using single diamond abrasive grain
2. Laser assisted micro-milling of hard-to-machine materials
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4. Study of the effects of laser micro structuring on grinding of silicon nitride ceramics
5. An investigation of laser-assisted machining of Al2O3 particle reinforced aluminum matrix composite
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