Robotic pick-and-place of novel objects in clutter with multi-affordance grasping and cross-domain image matching

Author:

Zeng Andy1ORCID,Song Shuran1,Yu Kuan-Ting2,Donlon Elliott2,Hogan Francois R.2,Bauza Maria2,Ma Daolin2,Taylor Orion2,Liu Melody2,Romo Eudald2,Fazeli Nima2,Alet Ferran2,Chavan Dafle Nikhil2ORCID,Holladay Rachel2,Morona Isabella2,Nair Prem Qu1,Green Druck2,Taylor Ian2,Liu Weber1,Funkhouser Thomas1,Rodriguez Alberto2

Affiliation:

1. Princeton University, Princeton, NJ, USA

2. Massachusetts Institute of Technology, Cambridge, MA, USA

Abstract

This article presents a robotic pick-and-place system that is capable of grasping and recognizing both known and novel objects in cluttered environments. The key new feature of the system is that it handles a wide range of object categories without needing any task-specific training data for novel objects. To achieve this, it first uses an object-agnostic grasping framework to map from visual observations to actions: inferring dense pixel-wise probability maps of the affordances for four different grasping primitive actions. It then executes the action with the highest affordance and recognizes picked objects with a cross-domain image classification framework that matches observed images to product images. Since product images are readily available for a wide range of objects (e.g., from the web), the system works out-of-the-box for novel objects without requiring any additional data collection or re-training. Exhaustive experimental results demonstrate that our multi-affordance grasping achieves high success rates for a wide variety of objects in clutter, and our recognition algorithm achieves high accuracy for both known and novel grasped objects. The approach was part of the MIT–Princeton Team system that took first place in the stowing task at the 2017 Amazon Robotics Challenge. All code, datasets, and pre-trained models are available online at http://arc.cs.princeton.edu/

Publisher

SAGE Publications

Subject

Applied Mathematics,Artificial Intelligence,Electrical and Electronic Engineering,Mechanical Engineering,Modelling and Simulation,Software

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