Scaling Hard Vertical Surfaces with Compliant Microspine Arrays
Author:
Affiliation:
1. School of Engineering, Stanford University, Stanford, California 94305-2232,
2. Department of Mechanical Engineering, University of Utah, Salt Lake City, Utah 84112-9208,
3. University of Pisa, Pisa, Italy,
Abstract
Publisher
SAGE Publications
Subject
Applied Mathematics,Artificial Intelligence,Electrical and Electronic Engineering,Mechanical Engineering,Modelling and Simulation,Software
Link
http://journals.sagepub.com/doi/pdf/10.1177/0278364906072511
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