A Coupled Hygrothermal Cohesive-Layer Constitutive Model for Simulating Debond Growth
Author:
Affiliation:
1. School of Mechanical and Aerospace Engineering, Oklahoma State University, Stillwater, OK 74078, USA
Abstract
Publisher
SAGE Publications
Subject
Materials Chemistry,Polymers and Plastics,Ceramics and Composites
Link
http://journals.sagepub.com/doi/pdf/10.1177/096739110301100803
Reference13 articles.
1. A Continuum Model for Void Nucleation by Inclusion Debonding
2. An analysis of tensile decohesion along an interface
3. The influence of plasticity on mixed mode interface toughness
4. Effect of T-Stress on mode I crack growth resistance in a ductile solid
5. Crack Propagation in a Nonlinearly Viscoelastic Solid With Relevance to Adhesive Bond Failure
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