A Novel Silicon-containing Ethynylarene Resin as Heat-resistant Thermoset

Abstract

A series of novel processable and heat-resistant silicon-containing resins (PSA-E resins) were successfully synthesized by the reaction of 1,3,5-tris-(4-ethynylphenyl)benzene (TEPHB) with silylene-acetylene polymer (PSA resin) with high yields. The molecular structure, thermal curing processes and thermal properties were characterized by FTIR, 1HNMR, GPC, DSC and TGA. The results indicated that these novel resins could be melted at room temperature and thermally cured at 200–250 °C with low exothermal heat. Owing to the complete crosslinking of ethynyl groups, the Td5 (temperature of 5% weight loss) for all the thermosets are above 500 °C, and the overall char yields were above 87% at 900 °C under nitrogen.