Casting Antimicrobial Packaging Films and Measuring Their Physical Properties and Antimicrobial Activity

Author:

Han Jung H.1,Floros John D.2

Affiliation:

1. Department of Food Science and Technology, University of California, Davis, CA 95616; Department of Food Science, Purdue University, West Lafayette IN 47907-1160

2. Department of Food Science, Purdue University, West Lafayette IN 47907-1160

Abstract

Antimicrobial film was extruded using LDPE resins and potassium sorbate powder; its tensile properties, transparency and antimicrobial activity were measured to examine the adaptability as a packaging material. The tensile properties were not affected significantly by the incorporation of potassium sorbate to 3% (w/w) in the film. However, transparency of the film decreased as the concentration of potassium sorbate increased. The antimicrobial film decreased the growth rate and maximum growth of yeast, and extended the lag period before mold growth was apparent. Therefore, it can prevent or reduce the rate of microbial spoilage in low viscosity liquids and on the contacted surface area of solid food products and thus may prolong the shelf life of food products when it is used as a packaging material.

Publisher

SAGE Publications

Subject

Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films

Reference12 articles.

1. ASTM . 1987. Selected ASTM Standards on Packaging, 2nd Ed.,Philadelphia, PA: ASTM, pp. 42-53.

2. Black, J. 1992. Biological Performance of Materials, Fundamentals of Biocompatibility, 2nd Ed.,New York, NY: Marcel Dekker, Inc., pp. 73-91.

3. Chang, R. 1981. Physical Chemistry with Applications to Biological Systems, 2nd Ed., New York, NY: Macmillan Publishing Co., Inc., p. 505-505.

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3