Enhancement of atomic oxygen resistance for heat-sealable isomeric co-polyimide films by combining ether linkage with diphenylphosphine oxide

Author:

Ni Hongjiang1ORCID,Yang Xiaoke2,Li Jun1,Zhang Daijun1,Liu Jingang3,Yang Shiyong4,Chen Xiangbao1

Affiliation:

1. Research Center of Soft Materials, Aero Engine Corporation of China Beijing Institute of Aeronautical Materials, Beijing, China

2. Beijing Institute of Graphene Technology, Beijing, China

3. School of Materials Science and Technology, China University of Geosciences, Beijing, China

4. Key Laboratory of Science and Technology on High-tech Polymer Materials, Chinese Academy of Sciences, Beijing, China

Abstract

Heat-sealable isomeric co-polyimide (CPI) films with enhanced atomic oxygen (AO) resistance and mechanical strength were synthesized from 2,3,3,4-oxydiphthalic anhydride (aODPA), 4,4-oxydianiline (ODA), and 2,5-bis [(4-aminophenoxy)phenyl]diphenylphosphine oxide (BADPO). We investigated how the molecular structure and diamine ratio affected the thermal properties, solubility, mechanical properties, AO resistance and heat-sealability. The diphenylphosphine oxide (DPO) side group decreased the CPI film mechanical strength and its higher ODA reactivity increased the molecular weight. At 10 mol% ODA in the aODPA-BADPO system, the CPI film exhibited increased tensile strength with no detriment to the AO resistance. Meanwhile, the CPI films demonstrated good heat-sealability indicated by a completely merged interface after heat sealing.

Funder

Young Elite Scientists Sponsorship by CAST

National Natural Science Foundation of China

Publisher

SAGE Publications

Subject

Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Advances in atomic oxygen resistant polyimide composite films;Composites Part A: Applied Science and Manufacturing;2023-05

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