Thin film bonded to elastic orthotropic substrate under thermal loading
Author:
Affiliation:
1. Department of Engineering Enzo Ferrari (DIEF), University of Modena and Reggio Emilia, Modena, Italy
2. Department of Sciences and Methods for Engineering (DISMI), University of Modena and Reggio Emilia, Reggio Emilia, Italy
Abstract
Publisher
SAGE Publications
Subject
Applied Mathematics,Mechanical Engineering,Mechanics of Materials,Modelling and Simulation
Link
http://journals.sagepub.com/doi/pdf/10.1177/0309324716642931
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