Anti-plane analysis of a crack terminating at interface of the isotropic half-planes bonded to intact orthotropic layers

Author:

Sadeghi Jaber1,Vafa Jalil Pourmohammadi1,Fariborz Shahriar1ORCID

Affiliation:

1. Department of Mechanical Engineering, Amirkabir University of Technology (Tehran Polytechnic), Tehran, Iran

Abstract

The analysis of a cracked isotropic half-plane perfectly bonded to an intact orthotropic layer is accomplished. A crack tip terminates at or is adjacent to the interface of the orthotropic layer and substrate while sustaining anti-plane traction. The power of stress singularity at the crack tip, situated in the interface, is obtained for different crack orientations and composite layers. Employing the integral transform method stress field caused by a screw dislocation in the substrate is determined. The dislocation solution is used to construct an integral equation for the density of dislocations on the crack surface. The numerical solution to integral equations is utilized to obtain stress intensity factors at the crack tip inside the substrate, crack opening displacements, and contours of the second invariant of stress deviator around the crack tip, situated at or close to the interface, for different crack orientations and orthotropic layers.

Publisher

SAGE Publications

Subject

Applied Mathematics,Mechanical Engineering,Mechanics of Materials,Modeling and Simulation

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3