Pre-trained CNN-based TransUNet Model for Mixed-Type Defects in Wafer Maps
Author:
Kim Youngjae1, Lee Jee-Hyong1, Jeong Jongpil1
Affiliation:
1. Department of Computer Science and Engineering, Sungkyunkwan University, 2066 Seobu-ro Jangan-gu, Suwon, 16419, REPUBLIC OF KOREA
Abstract
Classifying the patterns of defects in semiconductors is critical to finding the root cause of production defects. Especially as the concentration density and design complexity of semiconductor wafers increase, so do the size and severity of defects. The increased likelihood of mixed defects makes finding them more complex than traditional wafer defect detection methods. Manually inspecting wafers for defects is costly, creating a need for automated, artificial intelligence (AI)-based computer vision approaches. Previous research on defect analysis has several limitations, including low accuracy. To analyze mixed-type defects, existing research requires a separate model to be trained for each defect type, which is not scalable. In this paper, we propose a model for segmenting mixed defects by applying a pre-trained CNN-based TransUNet using N-pair contrastive loss. The proposed method allows you to extract an enhanced feature by repressing extraneous features and concentrating attention on the defects you want to discover. We evaluated the model on the Mixed-WM38 dataset with 38,015 images. The results of our experiments indicate that the suggested model performs better than previous works with an accuracy of 0.995 and an F1-Score of 0.995.
Publisher
World Scientific and Engineering Academy and Society (WSEAS)
Subject
Computer Science Applications,Information Systems
Reference19 articles.
1. Shu-Kai S. Fan, Chia-Yu Hsu, Du-Ming Tsai, Fei He, Chun-Chung Cheng, Data-driven approach for fault detection and diagnostic in semiconductor manufacturing, IEEE Transactions on Automation Science and Engineering, Vol.17, Issue.4, 2020, pp. 1925– 1936. 2. Erik H.M. Heijne, Future semiconductor detectors using advanced microelectronics with post-processing, hybridization and packaging technology. Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, Vol.541, Issues.1-2, 2020, pp. 274–285. 3. Chih-Hung Chang, Brian K. Paul, Vincent T. Remcho, Sundar Atre, James E. Hutchison, Synthesis and post-processing of nanomaterials using microreaction technology, Journal of Nanoparticle Research, Vol.10, 2008, pp. 965–980. 4. P. Grybos, Front-End Electronics for Multichannel Semiconductor Detector Systems, Institute of Electronic Systems, Warsaw University of Technology: Warsaw, Poland, 2020, pp. 132–135. 5. Ofer Sneh, Robert B. Clark-Phelps, Ana R. Londergan, Jereld Winkler, Thomas E. Seidel, Thin film atomic layer deposition equipment for semiconductor processing, Thin Solid Film, Vol.403, Issues.1-2, 2020, pp. 248–261.
|
|