Eight-Element Microstrip Series Feed Antennas with Air Vias For 5G Applications

Author:

Al Azzawi A. Menam1,Rahim Mohamad Kamal A.1,Ayop Osman1

Affiliation:

1. Advanced RF & Microwave Research Group (ARFMRG), Faculty of Electrical Engineering, University Technology Malaysia (UTM), 81310, UTMJB Johor, MALAYSIA

Abstract

This study presents the design and fabrication of a novel series feed array antenna structure consisting of eight elements, each integrated with 0.5mm air vias and separated by 0.9mm distances. The research investigates the impact of air vias on millimeter wave 5G applications, utilizing Roger 5880 substrate (εr = 2.2, loss tangent = 0.0009, thickness = 0.508mm) for resonance within the 26-28 GHz range. The inclusion of air vias demonstrates a reduction in interference, evidenced by changes in current density, surface current distribution, and VSWR. The antennas, configured with 20 x 60 mm substrates and λ/2 element spacing, exhibit improved return loss (32 dB to 38 dB) and closer alignment with desired VSWR values upon integrating air vias. The study also reveals heightened surface current and density at the radiating element edges due to the vias' dielectric properties. Computational simulations utilizing CST studio validate the structural designs.

Publisher

World Scientific and Engineering Academy and Society (WSEAS)

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