Thinning of SOI by numerically controlled Plasma CVM (Chemical Vaporization Machining)-Evaluation of Machined Surface for Electron Devices--Reference-Cited by-同舟云学术

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Thinning of SOI by numerically controlled Plasma CVM (Chemical Vaporization Machining)-Evaluation of Machined Surface for Electron Devices-

Published:2003 Issue:5 Volume:69 Page:721-725
ISSN:1882-675X
Container-title:Journal of the Japan Society for Precision Engineering
language:ja
Short-container-title:Journal of the Japan Society for Precision Engineering

Author:

MORI Yuzo,SANO Yasuhisa,YAMAMURA Kazuya,MORITA Satoru,MORITA Mizuho,OHSHIMA Ichiro,SAITO Yuji,SUGAWA Shigetoshi,OHMI Tadahiro

Publisher

Japan Society for Precision Engineering

Subject

Mechanical Engineering

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Damage-free polishing of SiC by Slurryless Electrochemical Mechanical Polishing;Journal of The Surface Finishing Society of Japan;2022-11-01

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