The strategies used for curing universal adhesives affect the micro-bond strength of resin cement used to lute indirect resin composites to human dentin

Author:

ARAOKA Daisuke1,HOSAKA Keiichi1,NAKAJIMA Masatoshi1,FOXTON Richard2,THANATVARAKORN Ornnicha3,PRASANSUTTIPORN Taweesak4,CHIBA Ayaka1,SATO Kento1,TAKAHASHI Masahiro1,OTSUKI Masayuki1,TAGAMI Junji1

Affiliation:

1. Cariology and Operative Dentistry, Department of Oral Health Sciences, Graduate School of Medical and Dental Sciences, Tokyo Medical and Dental University

2. Restorative Dentistry, King’s College London Dental Institute, King’s College London

3. Faculty of Dentistry, Bangkok Thonburi University

4. Department of Restorative Dentistry and Periodontology, Faculty of Dentistry, Chiangmai University

Publisher

Japanese Society for Dental Materials and Devices

Subject

General Dentistry,Ceramics and Composites

Reference33 articles.

1. 1) Tagami A, Takahashi R, Nikaido T, Tagami J. The effect of curing conditions on the dentin bond strength of two dual-cure resin cements. J Prosthodont Res 2017; 61: 412-418.

2. 2) Mesaros AJ Jr, Evans DB, Schwartz RS. Influence of a dentin bonding agent on the fracture load of Dicor. Am J Dent 1994; 7: 137-140.

3. 3) Jensen ME, Sheth JJ, Tolliver D. Etched-porcelain resin-bonded full-veneer crowns: in vitro fracture resistance. Compendium 1989; 10: 336-8, 40-1, 44-47.

4. 4) el-Mowafy O. The use of resin cements in restorative dentistry to overcome retention problems. J Can Dent Assoc 2001; 67: 97-102.

5. 5) Perugia C, Ferraro E, Docimo R. Immediate dentin sealing in indirect restorations of dental fractures in paediatric dentistry. Eur J Paediatr Dent 2013; 14: 146-149.

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3