Author:
Voss H,Kilner J,Baraze R,Mobilia J,Chenette, zooijen, R D,Aamodt E,Kash R,Goodwater A,Kwok E
Publisher
American Institute of Aeronautics and Astronautics
Reference9 articles.
1. The authors wish to acknowledge Mr. M. Hilsenrath atLMSC forassistingwiththetesting of the single channel FE chip and Mr. E. L. McFeaters for assisting with the quality manufacturing.Mr. W. StansburyofPromex for COB assembly and bonding of the die. Dr. R. Kubacki of Ionic Systemsperformed the plasma Si 3N, sealing. M. A. Garrison of GSFC performed the NASA review of the SCOB process. We also thank Drs. T. R. Fisher, R. W. Nightingale, E. G. Shelley,andR.R.Vondrak of LMSC for their encouragement and support. Several students at Taylor University helped with the development of this paper. Thanks are extended to theNASA GGS team for supporting the SEPS advanced design and microchip developmenteffort under contractNAS5-30622. This paper has been supported by the Lockheed Independent Research and Development Program and by the Taylor University Science Research TrainingProgram.
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