Multiple-Surrogate Approach to Helicopter Rotor Blade Vibration Reduction
Author:
Affiliation:
1. University of Michigan, Ann Arbor, Michigan 48109
2. University of Florida, Gainesville, Florida 32611
Publisher
American Institute of Aeronautics and Astronautics (AIAA)
Subject
Aerospace Engineering
Link
http://arc.aiaa.org/doi/pdf/10.2514/1.40291
Reference32 articles.
1. Helicopter vibration reduction using structural optimization with aeroelastic/multidisciplinary constraints - A survey
2. Recent Applications of Design Optimization to Rotorcraft-A Survey
3. A Survey of Recent Developments in Rotorcraft Design Optimization
4. Vibration reduction in rotorcraft using active control - A comparison of various approaches
5. Surrogate-based analysis and optimization
Cited by 66 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Proper Orthogonal Decomposition-Based Surrogate Modeling Approximation for Aeroengines Nonlinear Unbalance Responses;Journal of Engineering for Gas Turbines and Power;2023-10-26
2. A Generalized Methodology for a Highly Parallelizable Uncoupled Method for Static Aeroelastic Analysis in Support of Design Optimization;AIAA SCITECH 2023 Forum;2023-01-19
3. Multi-objective design and optimization of forklift gantry by using multiple surrogate models;Revista Internacional de Métodos Numéricos para Cálculo y Diseño en Ingeniería;2023
4. Aerodynamic Data-Driven Surrogate-Assisted Teaching-Learning-Based Optimization (TLBO) Framework for Constrained Transonic Airfoil and Wing Shape Designs;Aerospace;2022-10-17
5. Aeroelastic Design and Comprehensive Analysis of Composite Rotor Blades Through Cluster-Based Kriging;AIAA Journal;2022-10
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3