Space-Plug-and-Play Avionics (SPA): A Three-Year Progress Report
Author:
Affiliation:
1. Air Force Research Laboratory
Publisher
American Institute of Aeronautics and Astronautics
Link
http://arc.aiaa.org/doi/pdf/10.2514/6.2007-2928
Reference35 articles.
1. A 36-chip multiprocessor multichip module made with the General Electric high density interconnect technology
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