Survey of Ultra-High Temperature Materials for Applications Above 2000 K
Author:
Affiliation:
1. Purdue University
2. Packer Engineering
Publisher
American Institute of Aeronautics and Astronautics
Link
http://arc.aiaa.org/doi/pdf/10.2514/6.2009-6508
Reference55 articles.
1. 3Tiley,R.J.D.,UnderstandingSolids,Wiley,Inc.,NewYork,NY,2004,Chap.7.
2. Diffusion creep in oxide ceramics
3. Creep-Fatigue Crack Growth Interaction in Nickel Base Supper Alloy
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