Delayering Techniques: Dry/Wet Etch Deprocessing and Mechanical Top-Down Polishing-Reference-Cited by-同舟云学术

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Delayering Techniques: Dry/Wet Etch Deprocessing and Mechanical Top-Down Polishing

Published:2019 Issue: Volume: Page:379-390
ISSN:
Container-title:Microelectronics Failure Analysis
language:
Short-container-title:

Author:

Yap Huei Hao,Lau Zhi Jie

Publisher

ASM International

Reference20 articles.

1. Delayering Techniques: Dry Processes, Wet Chemical Processing and Parallel Lapping;Wills;Microelectronics Failure Analysis Desk Reference

2. Semiconductor Technology from A to Z, Chapter, Metallization, Aluminum technology, “https://www.halbleiter.org/en/metallization/”.

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Large-Scale Delayering of Semiconductor Devices with Nanometer-Scale Uniformity over a Millimeter-Scale Area;Journal of Failure Analysis and Prevention;2024-08-28

2. Lightweight Countermeasures Against Original Linear Code Extraction Attacks on a RISC-V Core;2023 IEEE International Symposium on Hardware Oriented Security and Trust (HOST);2023-05-01

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