The Role of Materials in Defining Process Constraints

Author:

Abstract

Abstract This chapter considers the materials and processing aspects of soldering and the manner in which these interrelate in the development of joining processes. It discusses the processes involved in eliminating or suppressing metallurgical and mechanical constraints as well as constraints imposed by the components.

Publisher

ASM International

Reference59 articles.

1. Void Reduction in Large Area Bonding of IC Components;Bascom;Solid State Technol.,1975

2. Carbon Fiber Silver-Copper Brazing Filler Composites for Brazing Ceramics;Cao;Weld. J.,1992

3. Moisture Control in Hermetic Leadless Chip Carriers with Silver-Epoxy Die Attach Adhesive;Carley;RCA Review,1984

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