Waveform Acquisition from the Backside of Silicon Using Electro-Optic Probing-Reference-Cited by-同舟云学术

Waveform Acquisition from the Backside of Silicon Using Electro-Optic Probing

Published:1999-10-01 Issue: Volume: Page:
ISSN:0890-1740
Container-title:International Symposium for Testing and Failure Analysis
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Author:

Bruce Mike¹,Dabney Greg¹,McBride Shawn¹,Mulig Jason¹,Bruce Victoria¹,Bachand Charles¹,Kasapi Steven²,Block Jeffrey A.²

Affiliation:

1. Advanced Micro Devices, Inc., Austin, Texas

2. Schlumberger ATE, Austin, Texas

Abstract

Abstract A new tool (Schlumberger IDS 2000) has become available for acquiring waveforms from C4 (also known as flip chip) packaged IC’s. The waveform acquisition technique is based on electro-optic sampling through the backside of silicon. After explaining the physics of electro-optic sampling, the technique is demonstrated through the backside of Si on a simple diode test structure and a flip chip microprocessor. Also, many of the issues and challenges with this tool are discussed.

Publisher

ASM International

Link

http://dl.asminternational.org/istfa/proceedings-pdf/doi/10.31399/asm.cp.istfa1999p0019/418700/istfa1999p0019.pdf

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